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Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging
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Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps
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| Topic |
Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic
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