Electronics System Packaging - Page 13

Topic
Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering
Lecture
Notes
Topic
Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss
Lecture
Notes
Topic
Mod-08 Lec-39 Thermal Design considerations in systems packaging
Lecture
Notes
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