 |
| Topic |
Mod-02 Lec-07 Wafer fabrication, inspection and testing
 |
| Lecture |
 |
| Notes |
|
| Topic |
Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices
|
| Lecture |
|
| Notes |
|
| Topic |
Mod-02 Lec-09 Wire bonding, TAB and flipchip-1
|
| Lecture |
|
| Notes |
 |
| Bookmarks |
0 Comments
Post a Comment